Product Features：
Miniaturized Lens-Array Integration
Integrates a mini lens array directly with the FAU, reducing assembly space and supporting compact high-density optical module layouts.
Low Insertion Loss / High Return Loss
Precision optical design and high-precision alignment deliver insertion loss ≤0.50 dB and return loss up to ≥60 dB, ensuring stable and efficient optical transmission.
Flexible Customization
Supports customization of lens pitch, fiber count, FAU type, fiber type, coating, and package dimensions to meet different module and photonic chip coupling requirements.
High-Precision Passive Alignment
Designed for accurate passive alignment with silicon photonic chips, LD/PD arrays, and fiber arrays, enabling high coupling efficiency and consistent batch performance.
Applications：
400G / 800G / 1.6T optical modules: QSFP-DD, OSFP, and other high-speed form factors
Silicon photonics coupling: edge coupling and grating coupling interfaces
Laser / detector array coupling: LD-to-fiber and fiber-to-PD array coupling
CPO (Co-Packaged Optics): high-density optical interconnects for next-generation data centers
Parallel optical modules and active optical cables (AOC)
High-channel-count optical interconnects and photonic integration systems
For detailed technical specifications or customized solutions, please contact our technical team.
