Applications:
Intra-Module Interconnect for 800G/1.6T Transceivers
Used internally within next-gen transceivers to connect the external MT receptacle (front panel) to the internal silicon photonics optical engine, supporting massive parallel data transmission with high signal integrity.
Silicon Photonics (PIC) Wafer/Chip Testing
Provides a fast, repeatable, and low-loss interface for testing 16-channel silicon photonic chips. The FA end couples to the chip’s grating/edge couplers, while the MT end plugs directly into standard optical test racks.
Co-Packaged Optics (CPO) & Optical Engines
Ideal for CPO architectures, providing a robust bridge between standard external MPO/MTP cabling and high-density, on-package photonic engines, optimizing space and routing.
Active Optical Cables (AOC) & Data Centers
Deployed in high-density AI computing clusters and hyperscale data centers where high-channel-count, low-latency optical links are required for GPU-to-GPU or switch-to-switch interconnects.
Compliance & Quality:
Manufactured under ISO 9001:2015 quality management systems and fully RoHS compliant. Each cable assembly undergoes strict end-face inspection and 100% optical testing (IL/RL) across all 16 channels to guarantee premium performance, consistency, and field reliability.
For custom FA dimensions, specific MT pin configurations, or volume quotations, please contact our sales engineering team.
