Applications:
Ultra-High Density Photonic Packaging
Ideal for environments with strict Z-axis height limitations. The lidless design allows the array to fit into extremely tight spaces within transceivers or co-packaged optics (CPO) structures.
Silicon Photonics & PIC Coupling
Used for edge coupling where the adhesive needs to be applied directly around the fiber and chip facet without interference from a bulky lid, enabling optimized curing and strain relief.
Optical Sensors & Test Equipment
Suitable for optical sensing arrays and multi-channel test fixtures where direct access to the fiber structure, or rapid prototyping assembly, is required.
Compliance & Quality:
Manufactured under ISO 9001:2015 quality management systems and fully RoHS compliant. Each unit undergoes rigorous dimensional inspection (pitch, angle, and surface quality) and 100% optical testing (IL/RL) to ensure it meets the demanding requirements of photonic assembly.
For specific substrate metallization, custom V-groove dimensions, or volume quotations, please contact our sales engineering team.
