Applications:
Grating Coupling
Perfectly designed for coupling to vertical grating couplers on silicon photonic chips. The 90° bend allows the fiber array to interface vertically with the chip surface, facilitating wafer-level testing and simplified edge-routing.
Co-Packaged Optics (CPO) & Optical Engines
In CPO architectures, optical engines are mounted directly next to the ASIC. The 90° FAU allows the optical connections to route vertically, preventing interference with the surrounding electrical traces and heat sinks.
VCSEL & Photodetector Array Coupling
Ideal for coupling vertical cavity surface-emitting lasers (VCSELs) or photodetector arrays in 3D optical sensing, LiDAR, and high-speed data communication systems.
Board-Level Optical Interconnects
Used in optical backplanes and board-to-board optical modules to transition light paths from horizontal waveguides to vertical transceiver ports, optimizing board real estate.
Compliance & Quality:
Manufactured under ISO 9001:2015 quality management systems and fully RoHS compliant. Each unit undergoes strict bend-radius inspection, visual examination of the metallization, and 100% optical testing (IL/RL) to ensure superior performance and reliability in critical photonic applications.
For custom bend configurations, specific metallization patterns, or volume quotations, please contact our sales engineering team.
