TAKFLY GROUP

100G 8° FA to Lens

The 100G 8° FA to Lens Assembly is a highly integrated, precision-engineered optical coupling component designed for next-generation 100G optical transceivers and silicon photonics packaging. This assembly seamlessly bridges an 8° angled physical contact (APC) Fiber Array (FA) on one end with a Micro-Lens Array (MLA) on the other, housed in a robust gold-metallized shell. By combining the low-reflection characteristics of an 8° polish with the beam-expanding capabilities of a lens array, it provides an ultra-low loss, high-tolerance interface for edge-emitting lasers, photonic integrated circuits (PICs), and high-speed optical engines.

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Applications:
Intra-Module Interconnect for 100G Transceivers
Used inside 100G QSFP28 or CWDM4/LR4 optical modules to couple light from the optical engine (laser/PD) to the external fiber port. The lens improves coupling efficiency, while the 8° APC prevents unwanted reflections.
Silicon Photonics (PIC) Edge Coupling
Specifically designed to interface with edge-emitting silicon photonic waveguides. The 8° angle optimizes transmission into the chip, and the lens array perfectly shapes the beam to match the sub-micron waveguide mode.
VCSEL & Photodetector Coupling
Ideal for coupling surface-emitting devices or photodetector arrays where beam collimation or focusing is required to maximize signal capture and reduce crosstalk.
High-Speed Optical Testing & Probing
Provides a low-reflection, high-tolerance interface for wafer-level probing of photonic chips. The robust housing allows for stable handling during automated probe station operations.
Compliance & Quality:
Manufactured under ISO 9001:2015 quality management systems and fully RoHS compliant. Each assembly undergoes strict 3D end-face geometry verification and 100% optical testing (IL/RL) to guarantee premium performance, consistency, and field reliability.

For custom lens designs, specific housing configurations, or volume quotations, please contact our sales engineering team.

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