Applications:
Silicon Photonics (PIC) Edge Coupling
The 8° APC end-face is specifically designed to minimize reflections when coupling light directly into the edge waveguides of a silicon photonic chip, making it ideal for high-performance transceiver packaging.
Intra-Module Interconnect for 400G/800G Transceivers
Used internally within high-speed transceivers to connect the external MT receptacle to the internal optical engine, ensuring high signal fidelity and low bit error rates in data center networks.
Wafer-Level & Chip-Level Optical Testing
Provides a fast, repeatable, and low-reflection interface for probing photonic chips. The FA end couples to the grating/edge couplers, while the MT end plugs directly into standard optical test racks.
Co-Packaged Optics (CPO) & Optical Engines
Ideal for CPO architectures, providing a robust and low-reflection bridge between standard external MPO/MTP cabling and high-density, on-package photonic engines.
Compliance & Quality：
Manufactured under ISO 9001:2015 quality management systems and fully RoHS compliant. Each cable assembly undergoes strict 3D end-face geometry verification (for the 8° angle) and 100% optical testing (IL/RL) across all channels to guarantee premium performance, consistency, and field reliability.
For custom FA dimensions, specific MT pin configurations, or volume quotations, please contact our sales engineering team.
